PCB Design - Revision history

Ivc: /* DirtyPCBs */

2019-10-29T15:55:04Z

DirtyPCBs

← Older revision		Revision as of 15:55, 29 October 2019
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	* [http://dirtypcbs.com/ dirtypcbs.com]		* [http://dirtypcbs.com/ dirtypcbs.com]

			=== JLCPCB ===

			The most affortable PCB manufacturrer with great quality, as of 2019. For 2USD you get 10 pcs + shipping.

			* [https://jlcpcb.com/ jlcpcb.com]

			You can also combine JLCPCB with [https://lcsc.com LCSC] for full assembly of PCBs.

	== Smart Prototyping ==		== Smart Prototyping ==

Ivc: /* PCB Manufacturers */

2016-02-19T15:56:04Z

PCB Manufacturers

← Older revision		Revision as of 15:56, 19 February 2016
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	== PCB Manufacturers ==		== PCB Manufacturers ==
	A great place to start is Ladyada's [http://www.ladyada.net/library/pcb/costcalc.html PCB cost calculator]. It lets you compare different manufacturers by cost per square inch. Note: Prices from 2007.
			To find a suitable manufacturer for your board can be daunting, but fortunately there is now a service which compares PCB manufacturers against a set of your parameters:

			* [http://pcbshopper.com/ pcbshopper.com]

			Another great place to start is Ladyada's [http://www.ladyada.net/library/pcb/costcalc.html PCB cost calculator]. It lets you compare different manufacturers by cost per square inch. Note: Prices from 2007.

	* [http://www.batchpcb.com BatchPCB] - Easy and cheap for small boards		* [http://www.batchpcb.com BatchPCB] - Easy and cheap for small boards

Ivc: /* Checklist */

2016-02-12T17:04:16Z

Checklist

← Older revision		Revision as of 17:04, 12 February 2016
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	* Balanced ground pours on each side of the board to avoid tension bending large boards		* Balanced ground pours on each side of the board to avoid tension bending large boards
	* Via ground stitching around the board perimeter		* Via ground stitching around the board perimeter

			== BOM Optimization ==

			Optimizing the BOM is important to reduce the cost and part diversity to an absolute minimum. For instance, can a 560 Ohm and 1k Ohm resistor be reduced to 2x 1k Ohm resistors.

			* Reduce resistors to common values, e.g. LED resistors to closes other value (1k, 2k, 10k, etc)
			* Multiple individual resistors can be reduced to single array part

	== Board config ==		== Board config ==

Ivc at 21:21, 12 August 2015

2015-08-12T21:21:32Z

← Older revision		Revision as of 21:21, 12 August 2015
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	* Date, YYYY-MM-DD of last revision edit		* Date, YYYY-MM-DD of last revision edit
	* Your initials, e.g. DASM for David Smith		* Your initials, e.g. DASM for David Smith
	* Fidutials, minimum two in each opposite corner
	* Balanced ground pours on each side of the board
	* Via ground stitching around the board perimeter
	* Designators facing down or to the right, or clustered separate in component arrangement form		* Designators facing down or to the right, or clustered separate in component arrangement form
	* Specific test points or vias without tenting		* Specific test points or vias without tenting
	* Labels of pin-outs for connectors, solder pads, pin headers or test points		* Labels of pin-outs for connectors, solder pads, pin headers or test points

			== Checklist ==
			* Run Design Rule Check (DRC) to find obvious faults
			* Check that necessary input protection is added, if needed (PTC, TVS didoes, etc)
			* Reverse-polarity Schottky diode right after the power source
	* No power or current carrying traces under sensors (accelerometers, gyroscopes, compass, etc.)		* No power or current carrying traces under sensors (accelerometers, gyroscopes, compass, etc.)
			* Fidutials, minimum two in each opposite corner, 1.5mm exposed copper with 3.0mm solder mask perimeter
			* View the top and bottom copper pour for weak areas or too thin bridges
			* Balanced ground pours on each side of the board to avoid tension bending large boards
			* Via ground stitching around the board perimeter

	== Board config ==		== Board config ==

Ivc at 18:37, 8 August 2015

2015-08-08T18:37:31Z

← Older revision		Revision as of 18:37, 8 August 2015
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	* Specific test points or vias without tenting		* Specific test points or vias without tenting
	* Labels of pin-outs for connectors, solder pads, pin headers or test points		* Labels of pin-outs for connectors, solder pads, pin headers or test points
			* No power or current carrying traces under sensors (accelerometers, gyroscopes, compass, etc.)

	== Board config ==		== Board config ==

Ivc: /* Board config */

2015-08-05T16:42:09Z

Board config

← Older revision		Revision as of 16:42, 5 August 2015
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	== Board config ==		== Board config ==
	* FR-4, FR-406, FR-408, FR-5, G10, CEM3, Rogers, ceramics - FR4 stands for Flame Retardant material made of woven glass reinforced epoxy resin		* FR-4, FR-406, FR-408, FR-5, G10, CEM3, Rogers, ceramics - Flex/0.6/0.8/1.0/1.2/1.6/2.0mm - FR4 stands for Flame Retardant material made of woven glass reinforced epoxy resin
	** Standard: FR4 1.6 mm thickness		** Standard: FR4 1.6 mm thickness
	* TG130, TG190, TG230 - Different temperature thresholds before the laminate begins to soften		* TG130, TG190, TG230 - Different temperature thresholds before the laminate begins to soften

Ivc: /* Required detailing */

2015-08-05T16:38:34Z

Required detailing

← Older revision		Revision as of 16:38, 5 August 2015
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	* Model number or product id		* Model number or product id
	* Board revision number		* Board revision number
			* Date, YYYY-MM-DD of last revision edit
	* Your initials, e.g. DASM for David Smith		* Your initials, e.g. DASM for David Smith
	* Fidutials, minimum two in each opposite corner		* Fidutials, minimum two in each opposite corner

Ivc: /* Good practices */

2015-08-05T16:36:45Z

Good practices

@@ Line 68: / Line 68: @@
 For further details, check this great resource:
 * [http://www.mbedded.ninja/pcb-design mbedded PCB design]
 == Board config ==

Ivc: /* Good practices */

2015-08-05T13:23:18Z

Good practices

← Older revision		Revision as of 13:23, 5 August 2015
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	** Add a final rectangular polygon plane over the entire design and click Ratsnest - this helps to avoid board warping, better ground and signal conditions		** Add a final rectangular polygon plane over the entire design and click Ratsnest - this helps to avoid board warping, better ground and signal conditions
	** To only see the board without the pour, use Ripup on the polygon		** To only see the board without the pour, use Ripup on the polygon

			For further details, check this great resource:
			* [http://www.mbedded.ninja/pcb-design mbedded PCB design]

	== Board config ==		== Board config ==

Ivc at 18:50, 2 March 2015

2015-03-02T18:50:27Z

← Older revision		Revision as of 18:50, 2 March 2015
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	* [http://www.ami.ac.uk/courses/topics/0254_padep/ Panels and de-panelling tips]		* [http://www.ami.ac.uk/courses/topics/0254_padep/ Panels and de-panelling tips]

			== PCB Assembler ==

			=== Gold Phoenix PCB ===
			Professional PCB assembler, can manufacture the PCBs and part assembly.

			* [http://goldphoenixpcb.com/ holdphoenixpcb.com]

			=== Smart Prototyping ===
			Great for small runs. Fast response via email and focus on getting it right. Can do part sourcing.

			* [http://smart-prototyping.com smart-prototyping.com]